2013年11月24日 星期日

Automation vendors have announced various services

Over the last few years a number of automation vendors have announced various services including outsourced maintenance, system integration, manufacturing and business process consulting, and remote operations. I wonder if an automation vendor can continue to be effective as both a product company and services provider.

To clarify the difference, let’s start by defining what I mean by services and products. By providing services, automation vendors engage with customers to perform labor and knowledge intensive tasks that may include system design, engineering services, system integration, preventative maintenance, remote operations, and other services. By providing products, automation vendors sell something to the customers, system integrators and engineering firms that they will apply to accomplish automation tasks in manufacturing and process environments.

refer to:http://www.automation.com/portals/factory-discrete-automation/can-automation-vendors-serve-two-masters-products-services

2013年11月14日 星期四

Acrosser unveils its ultra slim fanless embedded system with 3rd generation Intel core i processor

Acrosser Technology Co. Ltd, a world-leading industrial and embedded computer designer and manufacturer, announces the new AES-HM76Z1FL embedded system. AES-HM76Z1FL, Acrosser’s latest industrial endeavor, is surely a FIT under multiple circumstances. Innovation can be seen in the new ultra slim fanless design, and its Intel core i CPU can surely cater for those seeking for high performance. Therefore, these 3 stunning elements can be condensed as "F.I.T. Technology." (Fanless, Intel core i, ultra Thin)
The heat sink from the fanless design provides AES-HM76Z1FL with great thermal performance, as well as increases the efficiency of usable space. The fanless design provides dustproof protection, and saving the product itself from fan malfunction. AES-HM76Z1FL has thin client dimensions, with a height of only 20 millimeters (272 mm x183 mm x 20 mm). This differs from most embedded appliances, which have a height of more than 50 millimeters.
The AES-HM76Z1FL embedded system uses the latest technology in scalable Intel Celeron and 3rd generation Core i7/i3 processors with a HM76 chipset. It features graphics via VGA and HDMI, DDR3 SO-DIMM support, complete I/O such as 4 x COM ports, 3 x USB3.0 ports, 8 x GPI and 8 x GPO, and storage via SATA III and Compact Flash. The AES-HM76Z1FL also supports communication by 2 x RJ-45 gigabit Ethernet ports, 1 x SIM slot, and 1 x MinPCIe expansion socket for a 3.5G or WiFi module.
Different from most industrial products that focus on application in one specific industry, the AES-HM76Z1FL provides solutions for various applications through the complete I/O interfaces. Applications of the AES-HM76Z1FL include: embedded system solutions, control systems, digital signage, POS, Kiosk, ATM, banking, home automation, and so on. It can support industrial automation and commercial bases under multiple circumstances.
Key features:
‧Fanless and ultra slim design
‧Support Intel Ivy Bridge CPU with HM76 chipset
‧2 x DDR3 SO-DIMM, up to 16GB
‧Support SATA III and CF storage
‧HDMI/VGA/USB/Audio/GPIO output interface
‧Serial ports by RS-232 and RS-422/485
‧2 x GbE, 1 x SIM, and 1 x MiniPCIe(for3G/WiFi)


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2013年11月11日 星期一

Industrial automation systems are performing

The advantage of this level of modularity extends well beyond the initial deployment, however. In the longer term, upgrading the level of performance is simply a matter of replacing the processor module – not the entire subassembly. This saves money, and minimizes unforeseen impact on the way in which the module as a whole interacts with its surroundings.

In the locomotive example mentioned, the COM Express processor module can be upgraded without affecting the connection to the engine I/O residing on the carrier board – reducing costly and time-consuming recertification and testing. The modularity of COM Express gives a whole new meaning to “technology insertion.”

Because of this modularity advantage, COM Express can substantially extend the useful life of key elements within critical infrastructures – a valuable benefit for industrial applications such as oil and gas, energy, and transportation. This is especially true when it comes to leveraging commercial technologies – often referred to as Commercial Off-the-Shelf (COTS).

In the past, vendors often used special niche and proprietary components on their products. However, for many of these component vendors, the long-term commitment to ensuring the continuing competitiveness of these products – with its requirement for extensive investment in R&D – meant that such components often had relatively short useful lifetimes, and didn’t benefit from the support of well-funded programs to minimize the impact of obsolescence.

Commercial products, however – such as those from Intel and AMD – could be expected to benefit from a development road map that would see successive generations of products emerge into the market, each compatible with its predecessor and each capable of delivering new levels of performance. This constant “upping the game” presents a real opportunity for users of COM Express technology – and it is an opportunity that modular architectures leverage to the maximum, enabling the Internet of Things (IoT) to become a practicable reality.

refer to:http://industrial-embedded.com/articles/rugged-increasingly-connected-world/

2013年11月4日 星期一

Transitioning to ARP4754A for UAV software development using model-based design

With model-based design, UAV engineers develop and simulate system models comprised of hardware and software using block diagrams and state charts, as shown in Figures 1 and 2. They then automatically generate, deploy, and verify code on their embedded systems. With textual computation languages and block diagram model tools, one can generate code in C, C++, Verilog, and VHDL languages, enabling implementation on MCU, DSP[], FPGA[], and ASIC hardware. This lets system, software, and hardware engineers collaborate using the same tools and environment to develop, implement, and verify systems. Given their auto-nomous nature, UAV systems heavily employ closed-loop controls, making system modeling and closed-loop simulation, as shown in Figures 1 and 2, a natural fit.
Testing actual UAV systems via ground-controlled flight tests is expensive. A better way is to test early in the design process using desktop simulation and lab test benches. With model-based design, verification starts as soon as models are created and simulated for the first time. Tests cases based on high-level requirements formalize simulation testing. A common verification workflow is to reuse the simulation tests throughout model-based design as the model transitions from system model to software model to source code to executable object code using code generators and cross-compilers.
An in-the-loop testing strategy is often used as itemized below and summarized in Table 2:
1. Simulation test cases are derived and run on the model using Model-In-the-Loop (MIL) testing.
2. Source code is verified by compiling and executing it on a host computer using Software-In-the-Loop (SIL) testing.
3. Executable object code is verified by cross-compiling and executing it on the embedded processor or an instruction set simulator using Processor-In-the-Loop (PIL) testing.
4. Hardware implementation is verified by synthesizing HDL and executing it on an FPGA using FPGA-In-the-Loop (FIL) testing.
5. The embedded system is verified and validated using the original plant model using Hardware-In-the-Loop (HIL) testing.
A requirements-based test approach with test reuse for models and code is explicitly described in ARP4754A, DO-178C, and DO-331, the model-based design supplement to DO-178C.

refer to:
http://mil-embedded.com/articles/transitioning-do-178c-arp4754a-uav-using-model-based-design/