The 2013 embedded world in Germany

 

Embedded world, the biggest and most important event of its kind, opens the series of high-tech exhibitions and knowledge-packed events at the Nürnberg venue from 26–28 February 2013. This event sets standards and records every year – now for the eleventh time in 2013. Exhibitors from all over the world present the entire spectrum of embedded systems: hardware, software, tools and services. “The embedded world Exhibition&Conference is growing continuously and rapidly in the same way that the embedded sector is gaining in importance – the embedded community can look forward to a record event,” says Alexander Mattausch, Exhibition Manager of embedded world. The specialists can also look forward once again to figures such as Prof. Nicholas McGuire or Dr. David Kalinsky, who have given the embedded world Conference a face, weight, spirit and know-how at a high professional standard for years. The electronic displays Conference is every bit as good. Stuart McClure, President and CEO of Cylance, opens embedded world on the first day with his keynote on “Safety and Security”.
Acrosser ------> Booth Hall 2 2-519

refer:
http://www.embedded-world.de/en/press/

3rd gnenration Core i7 Industrial Automation and Entertainment applications

 

ACM-B6360 carries on board Intel 3rd gnenration Core i7-3615QE FCBGA1023 processor which supports three independent display with multiple output : 24-bit LVDS, VGA, HDMI and one DDI interface. One PCI-E x16 Gen., 3.0 and seven PCI-Ex1 interfaces for IO expansion. It is suitable for Medical, Test & Measurement and Transportation applications.
ACM-B6360 and ACM-B4080 - COM Express Type 6 carrier board are available now. For more information, please contact ACROSSER Technology, ACROSSER USA, and ACROSSER worldwide resellers in your local area.

Fanless In-Vehicle computer with Intel 3rd Generation Core i platform

Its newest in-vehicle computer AIV-HM76V0FL features Intel HM76 mobile chipset and FCPGA 988 socket for 3rd generation Core i mobile computer platform. AIV-HM76V0FL adopts Acrosser’s expertise of design for in-vehicle applications. These designs include smart power management, high efficient thermal module, and diversity of integrated communication technology such as 4 USB 3.0, CAN bus, Wi-Fi, 3.5G wireless WAN, Bluetooth and GPS.

AIV-HM76V0FL is protected with the most complete power input protection to adapt the harsh electrical environment in any kind of vehicle. Such protections are automotive transient voltage suppression, over/under voltage protection, over current protection, reverse voltage protection and automotive fuse. These designs enable AIV-HM76V0FL to pass the strict ISO-7637-2 test what is specifically defined for equipments installed in various vehicles.

  The smart power management subsystem enables user to define the power on and off sequences through software interface or BIOS setting to meet any requirement of in-vehicle applications.

The AIV-HM76V0FL’s fanless thermal design provides the high reliability in vehicle applications. It utilizes advanced heat pipe, heat sink, and thermal pad to solve the problem of heat generated by CPU, Chipset, DRAM and power devices. This is a big challenge for designing a fanless computer what supports up to 45 Watts quad core of core i7-3720QM processors. All components used in AIV-HM76V0FL are industrial proven and only solid state capacitors are utilized for high MTBF.

About 3rd Generation Intel® Core™ i5 Chipset

3rd Generation Intel® Core™ i5
Choose our most popular family member and prepare to be thrilled by an automatic burst of speed whenever you need it for performance that adapts to you, thanks to Intel® Turbo Boost Technology 2.0. Plus, you’ll enjoy a rich visual experience with brilliant imagery, 3D visual support, and other enhancements from our built-in visuals.

All part of the amazing experience you get with the 3rd generation Intel® Core™ i5 processor.

from
http://www.intel.com/content/www/us/en/processors/core/core-i5-processor.html

Fanless and Dustproof Intel Atom D525/D425 Embedded Computer

AR-ES6003FL put CPU and chipset on top of the board and I/O on the bottom of the board. It increases the difficulty of design and manufacture. At the same time, it increases the efficiency of heat transferring because the heat sink is close to the CPU and chipset. It can connect to external heat sink directly that is optimizing thermal solution.

For embedded customer’s request to expand IO like serial port or usb, AR-ES6003FL designs the expansion slot with PCI Express x1 and PCI interface. In market you can see many expansion cards using PCI or PCI Express x1 for IO, but using PCI Express x16 ones are always for graphic request.

Acrosser offers two kinds of expansion cards as default, one is with 2 x PCI Express x1 slots and another is with 1 x PCI and 1 x PCI Express x1. For OEM/ODM request, we can offer maximum 2 x PCI and 2 x PCI Express x1 slots.

Industrial PC ,gaming Platform , Networking appliance

 

Acrosser provides customer the option and customer can use the module directly without other carrier board to avoid the shock or vibration issue.

Advanced Innovative Fanless Vehicle computer with Intel Core i platform

AIV-HM76V0FL is protected with the most complete power input protection to adapt the harsh electrical environment in any kind of vehicle. Such protections are automotive transient voltage suppression, over/under voltage protection, over current protection, reverse voltage protection and automotive fuse.


Acrosser, the leading industrial computer designer and manufacturer is pleased to announce the release of its newest in-vehicle computer AIV-HM76V0FL features Intel HM76 mobile chipset and FCPGA 988 socket for 3rd generation Core i mobile computer platform.

The AIV-HM76V0FL’s fanless thermal design provides the high reliability in vehicle applications. It utilizes advanced heat pipe, heat sink, and thermal pad to solve the problem of heat generated by CPU, Chipset, DRAM and power devices. This is a big challenge for designing a fanless computer what supports up to 45 Watts quad core of core i7-3720QM processors. All components used in AIV-HM76V0FL are industrial proven and only solid state capacitors are utilized for high MTBF.

embedded-single-boards ,in vehicle computers . single board computer

Contact us:
http://www.acrosser.com/inquiry.html

ISA half-size AR-B8172 board with Fanless Design

(Industrial computer, Industrial PC, industrial automation,ISA Half Size)

AR-B8172

Industrial PC Solution ,gaming ,network

Legacy ISA Supporting

AR-B8172 has legacy PC/104 interface that through ISA Bus by Vortex86DX. It doesn’t need a bridge chip to transfer PCI signal to ISA signal. It has good compatibility with the older carrier board, motion card or IO card. By true ISA supporting, it can replace the older or phased-out CPU platform like Ali or STPC. Those CPU are hard to buy and the cost is raised. AR-B8172 will be a nice alternative platform to develop.

Low Power Consumption Solution

AR-B8172 is equipped with Vortex86DX is a low power consumption platform. Vortex86DX’s power consumption is 2~3 Watts and the total power consumption of AR-B8172 under full-loading near 6 Watts. AR-B8172 also offers VGA output, two serial ports and four USB for basic IO requirement. AR-B8172 will be an ideal solution for embedded application which need lower CPU performance and less IO in harsh environment.

The following is features and specifications for AR-B8172:

‧CPU: Onboard DM&P Vortex86DX 800MHz‧Memory: Onboard 256MB DDR2 SDRAM‧Storage: 1 x IDE, 1 x CF, 1 x FDD‧Display: 1 x VGA‧Networking: 1 x 10/100 LAN‧USB: 4 x USB2.0 (4 x pin header)‧Serial: 1 x RS/232 (DB9), 1 x RS-232/422/485 (Pin header)

‧Power: 12V single voltage input.

‧Dimension: 185mm x 122mm (7.29” x 4.81”)

‧Operating Temperature: 32 to 140 deg. F (0 to 60 deg. C)

‧Operating System Support: Linux, Windows XP, DOS